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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. :Preliminary Data Issued Date : 2000.10.01 Revised Date : 2001.05.01 Page No. : 1/2 HAD825SP NPN EPITAXIAL PLANAR TRANSISTOR Features Darlington Transistor Absolute Maximum Ratings * Maximum Temperatures Storage Temperature .......................................................................................... -55 ~ +150 C Junction Temperature................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) .............................................................................. 625 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ........................................................................................ 80 V VCES Collector to Emitter Voltage ..................................................................................... 55 V VEBO Emitter to Base Voltage ........................................................................................... 12 V IC Collector Current ...................................................................................................... 600 mA Characteristics (Ta=25C) Symbol BVCBO BVCES BVEBO ICBO IEBO ICES *VCE(sat)1 *VCE(sat)2 *VBE(on) *hFE1 *hFE2 fT Cob Min. 80 55 12 10K 10K 125 Typ. Max. 100 100 500 1.2 1.5 1.5 100K 8 Unit V V V nA nA nA V V V Test Conditions IC=100uA, IE=0 IC=100uA, IB=0 IE=10uA, IC=0 VCB=60V, IE=0 VEB=10V, IC=0 VCE=50V, IB=0 IC=10mA, IB=0.01mA IC=100mA, IB=0.1mA IC=100mA, VCE=5V IC=10mA, VCE=5V IC=100mA, VCE=5V VCE=5V, IC=10mA, f =100MHz VCB=10V, f=1MHz MHz pF *Pulse Test : Pulse Width 380us, Duty Cycle2% HAD825SP HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92SP Dimension Spec. No. :Preliminary Data Issued Date : 2000.10.01 Revised Date : 2001.05.01 Page No. : 2/2 Style : Pin 1.Emitter 2.Collector 3.Base E 3 A 2 1 B C D F G 3-Lead TO-92SP Plastic Package, HSMC Package Code : N *:Typical DIM A B C D Inches Min. Max. 0.1450 0.1650 0.1063 0.1300 0.5000 *0.1000 Millimeters Min. Max. 3.70 4.20 2.70 3.30 12.7 *2.54 DIM E F G Inches Min. Max. 0.0160 0.0240 *0.0150 0.0800 0.1050 Millimeters Min. Max. 0.41 0.61 *0.38 2.03 2.67 Notes : 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : * Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : * Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 HAD825SP HSMC Product Specification |
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